| Density | Org | Part Number | VCC | Temp. Range | Speed (ns) | Packages |
|---|---|---|---|---|---|---|
| 1M | 128Kx8 | AS29CF010 | 5V | Industrial (-40° ~ +85°C) | 55 | PLCC(32) |
| 4M | 512×8 | AS29CF040 | 5V | Industrial (-40° ~ +85°C) | 55 | PLCC(32) |
| 8M | 1Mx8 / 512Kx16 | AS29CF800T | 5V | Industrial (-40° ~ +85°C) | 55 | TSOP I(48) |
| 1Mx8 / 512Kx16 | AS29CF800B | 5V | Industrial (-40° ~ +85°C) | 55 | TSOP I(48) | |
| 16M | 2Mx8 / 1Mx16 | AS29CF160T | 5V | Industrial (-40° ~ +85°C) | 55 | TSOP I(48) |
| 2Mx8 / 1Mx16 | AS29CF160B | 5V | Industrial (-40° ~ +85°C) | 55 | TSOP I(48) |
PLEASE NOTE:
PLCC = Plastic Leaded Chip Carriers (PLCC) are four-sided “J” Leaded Plastic body packages. Lead counts range from 20 to 84. PLCC packages can be square or rectangle. Body sizes range from .35″ to 1.15″. PLCCs are JEDEC standard compliant.
T = Top boot
B = Bottom boot
Micron is still building these parts specifically for Alliance Memory, and under a special agreement with Micron, we will continue to support these parts through 2021.
The following Micron-made M29F 5V NOR Flash parts available from now direct from Alliance Memory. These AEC-Q100 certified devices feature a 55ns access time and are offered with -40°C to +85°C and -40°C to +125°C extended temperature ranges.
| Part number | Density | Boot type | Configuration, speed, package option, temperature range, and shipping option |
|---|---|---|---|
| M29F200FB55M3F2 | 2Mb | Bottom | 256K x 8, 128K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 3 (-40°C~125°C) tape & reel |
| M29F400FB55M3F2 | 4Mb | Bottom | 512K x 8, 256K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 3 (-40°C~125°C) tape & reel |
| M29F400FB55N3E2 | 4Mb | Bottom | 512K x 8, 256K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray |
| M29F400FB55N3F2 | 4Mb | Bottom | 512K x 8, 256K x 16, parallel, 55ns 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tape and reel |
| M29F400FT5AN6E2 | 4Mb | Top | 512K x 8, 256K x 16, parallel, 55ns 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tray |
| M29F800FB5AN6E2 | 8Mb | Bottom | 1M x 8, 512K x 16, parallel, 55ns 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tray |
| M29F800FB5AN6F2 | 8Mb | Bottom | 1M x 8, 512K x 16, parallel, 55ns 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tape & reel |
| M29F800FB55M3F2 | 8Mb | Bottom | 1M x 8, 512K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 6 (-40°C~125°C), tape & reel |
| M29F800FT55N3E2 | 8Mb | Top | 1M x 8, 512K x 16, parallel, 55ns 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray |
| M29F160FB5AN6F2 | 16Mb | Bottom | 2M x 8, 1M x 16, parallel, 55ns 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tape & reel |
| M29F160FT55N3E2 | 16Mb | Top | 2M x 8, 1M x 16, parallel, 55ns 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray |
| Density | Technology | Boot Type | Speed and Grade | Package | Temp. Range | Shipping Options | Fab. |
|---|---|---|---|---|---|---|---|
| 200=2Mb. 400=4Mb, 800=8Mb, 160=16Mb | F=110nm technology | T=Top B=Bottom | 5A=55ns, AutoGrade6 55=55ns, Autograde3 | N=TSOP48 M= SOP44 | 6=(-40,85°C), 3=(-40,125°C) | E=RoHS, Tray F=RoHS, T&R | 2=Fab 13, Singapore |
M29FxxxFT/B Product Datasheet
Migrating from Spansion Am29F to Micron M29F NOR Flash Memories: Tech Note
Macronix MX29F Cross Reference Page
Legacy Automotive Parallel NOR Flash MPN Terminations (Extended): Micron PCN
Alliance Memory is now the authorized source for genuine J3, P30 & P33 Series 1.8V & 3V Parallel NOR Flash devices for storage applications from Micron Technology, Inc.
Micron is still building these parts specifically for Alliance Memory, and under a special agreement with Micron, we will continue to support these parts through 2021.
The following Micron-made 1.8V & 3V Parallel NOR Flash parts available now direct from Alliance Memory. These RoHS compliant devices are offered in 56L TSOP and 64ball BGA packages with Industrial -40°C to +85°C temperature ranges.
Micron’s J3, P30, and P33 series consist of high-performance single-bit cell (SBC) and multi-level cell (MLC) parallel Flash memory devices manufactured on 65nm NOR technology. They feature advanced write protection mechanisms, x8 and x16 bus widths, and are common flash interface (CFI) compatible.
| Series | Part number | Density | Block Config | Voltage | Temperature range | Package |
|---|---|---|---|---|---|---|
| J3 | JS28F128J3F75A | 128Mb | Uniform Block | Vcc/Q=2.7V~3.6V | -40°C to 85°C | 56-Lead TSOP |
| PC28F128J3F75A | 128Mb | Uniform Block | Vcc/Q=2.7V~3.6V | -40°C to 85°C | 64-ball BGA | |
| JS28F128J3F75B | 128Mb | Uniform Block | Vcc/Q=2.7V~3.6V | -40°C to 85°C | 56-Lead TSOP | |
| JS28F640J3F75A | 64Mb | Uniform Block | Vcc/Q=2.7V~3.6V | -40°C to 85°C | 56-Lead TSOP | |
| JS28F320J3F75A | 32Mb | Uniform Block | Vcc/Q=2.7V~3.6V | -40°C to 85°C | 56-Lead TSOP | |
| P30 | PC28F512P30BFB | 512Mb | Bottom Boot | Vcc=1.7V~2.0V | -40°C to 85°C | 64-ball BGA |
| PC28F640P30TF65A | 64Mb | Top Boot | Vcc=1.7V~2.0V | -40°C to 85°C | 64-ball BGA | |
| PC28F640P30BF65B | 64Mb | Bottom Boot | Vcc=1.7V~2.0V | -40°C to 85°C | 64-ball BGA | |
| P33 | PC28F512P33BFD | 512Mb | Bottom Boot | Vcc/Q=2.3V~3.6V | -40°C to 85°C | 64-ball BGA |
| PC28F128P33BF60A | 128Mb | Bottom Boot | Vcc/Q=2.3V~3.6V | -40°C to 85°C | 64-ball BGA | |
| JS28F128P33BF70A | 128Mb | Bottom Boot | Vcc/Q=2.3V~3.6V | -40°C to 85°C | 56-Lead TSOP | |
| PC28F640P33BF60A | 64Mb | Bottom Boot | Vcc/Q=2.3V~3.6V | -40°C to 85°C | 64-ball BGA |
J3 Series Datasheet : “J3_Series_datasheet.pdf”
J3 ROHS Certificate : “J3-ROHS-Certificate.pdf”
P30 Series Datasheet (64Mb) : “P30-64M-Datasheet.pdf”
P30 Series Datasheet (512Mb) : “P30-512M-Datasheet.pdf”
P30 Series IBIS files : “P30_ibis_files.rar”
P30 Series ROHS Certificate : “P30_ROHS-Certification.pdf”
P33 Series Datasheet (64Mb & 128Mb): “P33-64M_128M_Datasheet.pdf”
P33 Series Datasheet (512Mb): “P33-512M_Datasheet.pdf”
P33 Series ROHS Certificate : “P33_ROHS_Certification.pdf”
P33 Series IBIS Files : “P33_ibis_files.rar”
REACH Statement: “REACH_Statement.pdf”