LPDDR4-Mobile DDR4 / LPDDR4X – Mobile DDR4X
为了提高消费者、商业和工业市场的便携式电子产品的电池寿命，Alliance’s Memory的LPDDR4和LPDDR4X sdram（带/不带片上ECC）在200球FBGA封装中分别提供1.1V/1.8V和0.6V的低电压工作，具有x16和x32总线宽度选项。为嵌入式应用中的高级音频和高分辨率视频提供更高的效率，这些设备提供2.13GHz， 1.86GHz和1.6GHz的快速时钟速度，可实现4.26Gbps， 3.73Gbps和3.2Gbps的极高传输速率。工业级（工作温度范围为-40°C至+95°C）和汽车级（AEC-Q100合格工作温度范围为-40°C至+105°C）的密度从2Gb到32Gb。
LPDDR4-Mobile DDR4
| Density | Org | Part Number | Speed | Packages |
|---|---|---|---|---|
| 2Gb with ECC | 128Mx16 | AS4C128M16MD4 | 1600MHz | 200 ball FBGA (10mm x 14.5mm x 0.8mm) |
| 4Gb with ECC | 256Mx16 | AS4C256M16MD4 | 1600MHz | 200 ball FBGA (10mm x 14.5mm x 0.8mm) |
| 128Mx32 | AS4C128M32MD4 | 1600MHz | 200 ball FBGA (10mm x 14.5mm x 0.8mm) |
|
| 8Gb with ECC | 256Mx32 | AS4C256M32MD4 | 1600MHz | 200 ball FBGA (10mm x 14.5mm x 1.1mm) |
LPDDR4X – Mobile DDR4X
| Density | Org | Part Number | Speed | Packages |
|---|---|---|---|---|
| 2Gb with ECC | 128Mx16 | AS4C128M16MD4V | 1600MHz | 200 ball FBGA (10mm x 14.5mm x 0.8mm) |
| 4Gb with ECC | 256Mx16 | AS4C256M16MD4V | 1600MHz | 200 ball FBGA (10mm x 14.5mm x 0.8mm) |
| 8Gb with ECC | 256Mx32 | AS4C256M32MD4V | 1600MHz | 200 ball FBGA (10mm x 14.5mm x 0.8mm) |
| 8Gb | 512Mx16 | AS4C512M16MD4V | 1866MHz | 200 ball FBGA (10mm x 15mm x 1.0mm) |
| 16Gb | 1Gx16 | AS4C1G16MD4V | 2133MHz | 200 ball FBGA (10mm x 15mm x 1.0mm) |
| 512Mx32 | AS4C512M32MD4V | 1866MHz, 2133MHz | 200 ball FBGA (10mm x 15mm x 1.0mm) |
|
| 32Gb | 1Gx32 | AS4C1G32MD4V | 2133MHz | 200 ball FBGA (10mm x 15mm x 1.0mm) |