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SPI NAND

采用业内先进的制程，提供多种封装及产品等级，广泛应用于汽车、电力、视频监控、基站、光猫、路由器、机顶盒等行业。

Part No.	Interface	Bus Width	Den.	Voltage	Package	Dim.(mm)	Status	Temperature
SCF0BW1I2A	SPI	x1/x2/x4	512Mbit	3.3V	WSON8	8x6	CS	I
SCF0AW1I2A	SPI	x1/x2/x4	512Mbit	1.8V	WSON8	8x6	CS	I
SCF4BW1I3A	SPI	x1/x2/x4	4Gbit	3.3V	WSON8	8x6	CS	I
SCF4AW1I3A	SPI	x1/x2/x4	4Gbit	1.8V	WSON8	8x6	CS	I
SCF2BW1I3A	SPI	x1/x2/x4	2Gbit	3.3V	WSON8	8x6	CS	I
SCF2AW1I3A	SPI	x1/x2/x4	2Gbit	1.8V	WSON8	8x6	CS	I
SCF1BW1C2A	SPI	x1/x2/x4	1Gbit	3.3V	WSON8	8x6	CS	C
SCF1BW1I3A	SPI	x1/x2/x4	1Gbit	3.3V	WSON8	8x6	CS	I
SCF1BW2C2A	SPI	x1/x2/x4	1Gbit	3.3V	WSON8	6x5	CS	C
SCF1BW2I3A	SPI	x1/x2/x4	1Gbit	3.3V	WSON8	6x5	CS	I
SCF1AW1C2A	SPI	x1/x2/x4	1Gbit	1.8V	WSON8	8x6	CS	C
SCF1AW1I3A	SPI	x1/x2/x4	1Gbit	1.8V	WSON8	8x6	CS	I
SCF1AW2C2A	SPI	x1/x2/x4	1Gbit	1.8V	WSON8	6x5	CS	C
SCF1AW2I3A	SPI	x1/x2/x4	1Gbit	1.8V	WSON8	6x5	CS	I

Notes

Temperature Specification:

SLC: C =Commercial Temperature(-25 °C to +70 °C); I = Industrial Commercial Temperature(-40 °C to +85 °C)